Electron Microscopy Sciences Gold Thinner( Butyl Carbitol Acetate)

Electron Microscopy Sciences This ems one part epoxy gold paste is a gold-filled conductive bonding, exhibiting high electrical conductivity and bond strength. It is used in preference to silver-epoxy or other silver preparations to avoid silver migration problems, or when a higher signal is required. The gold paste is well suited to all sem work, and it bonds well to alumina ceramic substrate, phenolic circuit boards, and transistor headers. It is also useful in a variety of applications in solid state and hybrid circuits including attachment, bonding semiconductor devices, heat sinks, capacitor chips. - EMS (Additional S&H or Hazmat Fees May Apply)