We use cookies to make your experience better. To comply with the new e-Privacy directive, we need to ask for your consent to set the cookies. Learn about our cookie policy.
Electron Microscopy Sciences Epo-Tek® H22 Adhesive
List Price $330.40 Your Price $330.40
Electron Microscopy Sciences Epo-Tek H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 mont - EMS (Additional S&H or Hazmat Fees May Apply)
NETA PART: EMS-12673-22
MFG.PART: 12673-22
UNSPSC: 31201600
Manufacturer: Electron Microscopy Sciences
Electron Microscopy Sciences Epo-tek h22 is a two component, silver-filled epoxy system, designed for die bonding and sealing hybrid circuit and recommended for sem small angle cleavage and wafer bonding. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature. Smooth, free-flowing, slightly thixotropic paste. High tg allows it to be used for high temperature applications (=300 degree c). Contains no solvents – it is a nasa approved low outgasing epoxy. Excellent resistance to solvents, chemicals and moisture. Extended pot life and fast curing at low temperature <100 degree c. - EMS (Additional S&H or Hazmat Fees May Apply)
| SKU | EMS-12673-22 |
|---|---|
| Supplier Part Number | 12673-22 |
| UM | EA |
| UNSPSC | 31201600 |
| Manufacturer | Electron Microscopy Sciences |
| MSDS URL | Click here |
| CountryOfOrigin | United States |
| ProductLine | EMS |
| Qty | 1 |
| MinOrderQty | 1 |
| Weight | 0.100000 |
| Lead Time | 5 |
| Hazardous | Y |
| Energy Star | No |
| Green | No |
| Controlled | N |