Electron Microscopy Sciences Microscope Attachment Assembly

Electron Microscopy Sciences The model 170 ultrasonic disk cutter will quickly create disk, cylindrical, and rectangular tem specimens from hard/brittle materials such as ceramics, semiconductors, rocks or minerals, without mechanical or thermal damage. It cuts as thin as 10 µm or rods up to 10 mm long, from bulk samples or rectangular wafers for cross-section tem. Wafers are cut by an ultrasonic technique that uses the oscillation of two lead zirconate titanate crystals at 26 khz. The cutting medium is an abrasive slurry of boron nitride or silicon carbide. This rapid cutting process minimizes specimen damage and yields high quality samples in a few minutes. An automatic terminator stops cutting when the tool is in contact with the specimen plate. Tool motion is optimized to cut at the maximum rate while minimizing mechanical and thermal induced specimen damage. It features a unique design where the specimen is always presented parallel to the cutting axis. - EMS